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Bhutani, AkankshaLow Temperature Co-fired Ceramics for System-in-Package Applications at 122 GHzDissertationsschrift
Kartoniert, KIT Scientific Publishing (2019)
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This work presents a low temperature co-fired ceramic (LTCC) technology based system-in-package (SiP) operating beyond 100 GHz. The SiP encloses a semiconductor transceiver chip in a pea-sized LTCC package. The SiP is efficient and robust in terms of its electrical, thermal and mechanical characteristics. Moreover, it is low-cost and requires only standard manufacturing and assembly techniques. Finally, two fully-integrated 122 GHz radar sensors are demonstrated in LTCC technology.

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Low Temperature Co-fired Ceramics for System-in-Package Applications at 122 GHz

Dissertationsschrift

Bhutani, Akanksha

Kartoniert, 254 S.

graph. Darst.

Sprache: Englisch

21 cm

KIT Scientific Publishing (2019)

Gewicht: 485 g

ISBN-13: 978-3-7315-0945-5

Titelnr.: 80541873

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