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Dörr, DominikSimulation of the thermoforming process of UD fiber-reinforced thermoplastic tape laminates
Kartoniert, KIT Scientific Publishing (2021)
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In this work, initially, the requirements on a simulation model of the non-isothermal stamp forming process of unidirectional fiber-reinforced, and thermoplastic tape laminates are investigated experimentally. On this basis, different isothermal as well as a fully coupled thermomechanical simulation model under consideration of the crystallization kinetics are developed. For validation, a complex shaped geometry is simulated and compared to experimental forming results.

DETAILS

Simulation of the thermoforming process of UD fiber-reinforced thermoplastic tape laminates

Dörr, Dominik

Kartoniert, 336 S.

graph. Darst.

Sprache: Englisch

210 mm

ISBN-13: 978-3-7315-0998-1

Titelnr.: 95228825

Gewicht: 620 g

KIT Scientific Publishing (2021)

Karlsruher Institut für Technologie (KIT Scientific Publishing c/o KIT-Bibliothek

Straße am Forum 2

76131 Karlsruhe, Baden

info@ksp.kit.edu

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